2024

Zhukov, Sergey ; Ma, Xingchen ; Seggern, Heinz von ; Sessler, Gerhard M. ; Dali, Omar Ben ; Kupnik, Mario ; Zhang, Xiaoqing (2024)
Biodegradable cellular polylactic acid ferroelectrets with strong longitudinal and transverse piezoelectricity.
In: Applied Physics Letters, 2020, 117 (11)
doi: 10.26083/tuprints-00027715
Article, Secondary publication, Publisher's Version

Ma, Xingchen ; Zhukov, Sergey ; Seggern, Heinz von ; Sessler, Gerhard M. ; Dali, Omar Ben ; Kupnik, Mario ; Dai, Ying ; He, Pengfei ; Zhang, Xiaoqing (2024)
Biodegradable and Bioabsorbable Polylactic Acid Ferroelectrets with Prominent Piezoelectric Activity.
In: Advanced Electronic Materials, 2023, 9 (3)
doi: 10.26083/tuprints-00027704
Article, Secondary publication, Publisher's Version

Latsch, Bastian ; Schäfer, Niklas ; Grimmer, Martin ; Dali, Omar Ben ; Mohseni, Omid ; Bleichner, Niklas ; Altmann, Alexander A. ; Schaumann, Stephan ; Wolf, Sebastian I. ; Seyfarth, André ; Beckerle, Philipp ; Kupnik, Mario (2024)
3D-Printed Piezoelectric PLA-Based Insole for Event Detection in Gait Analysis.
In: IEEE Sensors Journal, 2024
doi: 10.26083/tuprints-00027733
Article, Secondary publication, Postprint

Chadda, Romol ; Dali, Omar Ben ; Latsch, Bastian ; Sundaralingam, Esan ; Kupnik, Mario (2024)
3D-Printed Strain Gauges Based on Conductive Filament for Experimental Stress Analysis.
IEEE SENSORS 2023. Vienna, Austria (29.10.2023-01.11.2023)
doi: 10.26083/tuprints-00027318
Conference or Workshop Item, Secondary publication, Postprint

Latsch, Bastian ; Dali, Omar Ben ; Chadda, Romol ; Schäfer, Niklas ; Altmann, Alexander A. ; Grimmer, Martin ; Beckerle, Philipp ; Kupnik, Mario (2024)
Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration.
IEEE SENSORS 2023. Vienna, Austria (29.10.2023-01.11.2023)
doi: 10.26083/tuprints-00027319
Conference or Workshop Item, Secondary publication, Postprint