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Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films

Sellami, Youssef ; Ben Dali, Omar ; Chadda, Romol ; Zhukov, Sergey ; Guermazi, Mahdi ; Altmann, Alexander A. ; Seggern, Heinz von ; Latsch, Bastian ; Schäfer, Niklas ; Kupnik, Mario (2024)
Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.26083/tuprints-00027320
Conference or Workshop Item, Secondary publication, Postprint

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Item Type: Conference or Workshop Item
Type of entry: Secondary publication
Title: Piezoelectret Sensors from Direct 3D-Printing onto Bulk Films
Language: English
Date: 3 May 2024
Place of Publication: Darmstadt
Year of primary publication: 2023
Place of primary publication: Piscataway, NJ
Publisher: IEEE
Book Title: 2023 IEEE SENSORS Proceedings
Collation: 4 Seiten
Event Title: IEEE SENSORS 2023
Event Location: Vienna, Austria
Event Dates: 29.10.-01.11.2023
DOI: 10.26083/tuprints-00027320
Corresponding Links:
Origin: Secondary publication service

The development of piezoelectric sensors using ferroelectrets is a very active field that is increasingly gaining importance. Recently, 3D-printing ferroelectret sensors using fused deposition modeling technique has been extensively investigated due to its unparalleled advantages in terms of design flexibility and cost-effectiveness. Nevertheless, printed structures are more rigid than bulk materials due to the minimal printable thicknesses. In this work, we present a new method that combines the advantages of 3D-printing with the high performance of bulk materials by bonding both layers in the printing process. Hereby, a polylactic acid (PLA) filament is directly printed on a 20 μm-thick bulk PLA film to form well-defined structures. This structure is thermally bonded with another PLA bulk film to form the ferroelectret. In order to enhance the sensitivity of the ferroelectrets, an additional elastomeric layer is utilized. By varying the material and thickness of the elastomeric cover, piezoelectric d₃₃-coefficients of 713 pC N ⁻¹ and 229 pC N ⁻¹ are achieved using Ecoflex™ and foamed thermoplastic polyurethane (TPU), respectively. Increasing the thickness of the Ecoflex™ cover shows a significant increase of 259 % of the piezoelectric d₃₃-coefficient.

Uncontrolled Keywords: Printing, Sensitivity, Programmable logic arrays, Sensor fusion, Sensors, Bonding, Ferroelectret, piezoelectret, piezoelectric sensors, 3D-printing, biodegradable
Status: Postprint
URN: urn:nbn:de:tuda-tuprints-273207
Classification DDC: 600 Technology, medicine, applied sciences > 621.3 Electrical engineering, electronics
Divisions: 18 Department of Electrical Engineering and Information Technology > Measurement and Sensor Technology
Date Deposited: 03 May 2024 12:28
Last Modified: 03 May 2024 12:28
URI: https://tuprints.ulb.tu-darmstadt.de/id/eprint/27320
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