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Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration

Latsch, Bastian ; Dali, Omar Ben ; Chadda, Romol ; Schäfer, Niklas ; Altmann, Alexander A. ; Grimmer, Martin ; Beckerle, Philipp ; Kupnik, Mario (2024)
Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.26083/tuprints-00027319
Conference or Workshop Item, Secondary publication, Postprint

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Item Type: Conference or Workshop Item
Type of entry: Secondary publication
Title: Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration
Language: English
Date: 3 May 2024
Place of Publication: Darmstadt
Year of primary publication: 2023
Place of primary publication: Piscataway, NJ
Publisher: IEEE
Book Title: 2023 IEEE SENSORS Proceedings
Collation: 4 Seiten
Event Title: IEEE SENSORS 2023
Event Location: Vienna, Austria
Event Dates: 29.10.-01.11.2023
DOI: 10.26083/tuprints-00027319
Corresponding Links:
Origin: Secondary publication service

Attempts in research to equip robotic end-effectors with tactile sensing facilitate an advanced environment perception and provide the means for dexterous interaction. Sensing at the fingertips can be realized using force sensors. In this work, we present an additively manufactured universal force-sensor offering structural integration to accomplish fast adaptation to application-specific needs. The piezoresistive sensor consists of commercially available conductive polylactic acid (PLA). Its geometry is based on rigid PLA spring elements to overcome the inherent limitations of elastomers. A curved shape increases the length of the deformation element, thus, the sensitivity, while retaining the flexibility necessary to allow for a displacement-induced change of the electrical resistance. The sensor features an additional integrated spring, which enables the adaptation of the mechanical stiffness and therefore of the measurement range. We use thread-forming screws to achieve a robust and enduring electrical connection between wires and the conductive polymer. The characterization of the sensor takes place in a universal testing machine with an applied load up to 5 N. The resistance measured gives a nearly linear characteristic and is proportional to the displacement. We obtain a sensitivity of 6.5 Ohm/N and a relative change of resistance of 6%. Low creep (0.12%) during phases with constant load reveals an advanced geometry-induced mechanical behavior. Thus, our printed piezoresistive PLA sensor demonstrates the suitability of conductive rigid materials for their tailored application as force sensors in robotics.

Uncontrolled Keywords: Sensitivity, Creep, Wires, Programmable logic arrays, Robot sensing systems, Force sensors, Electrical resistance measurement, printed, piezoresistive, force sensor, robotics, tactile sensing, structural integration, creep, sensitivity
Status: Postprint
URN: urn:nbn:de:tuda-tuprints-273194
Classification DDC: 600 Technology, medicine, applied sciences > 621.3 Electrical engineering, electronics
Divisions: 18 Department of Electrical Engineering and Information Technology > Measurement and Sensor Technology
Date Deposited: 03 May 2024 12:25
Last Modified: 03 May 2024 12:25
URI: https://tuprints.ulb.tu-darmstadt.de/id/eprint/27319
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