2024

Chadda, Romol ; Dali, Omar Ben ; Latsch, Bastian ; Sundaralingam, Esan ; Kupnik, Mario (2024)
3D-Printed Strain Gauges Based on Conductive Filament for Experimental Stress Analysis.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.26083/tuprints-00027318
Conference or Workshop Item, Secondary publication, Postprint

Latsch, Bastian ; Dali, Omar Ben ; Chadda, Romol ; Schäfer, Niklas ; Altmann, Alexander A. ; Grimmer, Martin ; Beckerle, Philipp ; Kupnik, Mario (2024)
Low Creep 3D-Printed Piezoresistive Force Sensor for Structural Integration.
IEEE SENSORS 2023. Vienna, Austria (29.10.-01.11.2023)
doi: 10.26083/tuprints-00027319
Conference or Workshop Item, Secondary publication, Postprint